µModule Power
µModule Power
Analog Devices’ µModule® (micromodule) regulators and DC-to-DC power products are complete system-in-package (SiP) power management solutions with integrated DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors within a compact, surface-mount BGA or LGA package. µModule power products support functions such as step-down (buck), step-down and step-up (buck-boost), battery charger, isolated converter, and LED driver. As a highly integrated solution with PCB Gerber files available for every device, µModule power products address time and space constraints while delivering a high efficiency, reliable, and, with select products, a low EMI solution compliant with EN 55022 Class B standards.
Analog Devices’ µModule® (micromodule) regulators and DC-to-DC power products are complete system-in-package (SiP) power management solutions with integrated DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors within a compact, surface-mount BGA or LGA package. µModule power products support functions such as step-down (buck), step-down and step-up (buck-boost), battery charger, isolated converter, and LED driver. As a highly integrated solution with PCB Gerber files available for every device, µModule power products address time and space constraints while delivering a high efficiency, reliable, and, with select products, a low EMI solution compliant with EN 55022 Class B standards.
μModule Power Technology
μModule® power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function into one compact package. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.


μModule Power Technology
μModule® power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function into one compact package. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.
{{modalTitle}}
{{modalDescription}}
{{dropdownTitle}}
- {{defaultSelectedText}} {{#each projectNames}}
- {{name}} {{/each}} {{#if newProjectText}}
-
{{newProjectText}}
{{/if}}
{{newProjectTitle}}
{{projectNameErrorText}}