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ADP5585
PRODUCTIONKeypad Decoder and I/O Expansion
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Part Details
- 16 element FIFO for event recording
- 10 configurable I/Os
- Key pad decoding for matrix up to 5x5, with an 11 GPIO (5x6) Option
- Key press/release interrupts
- GPIO functions
- GPI with selectable interrupt level
- 100k/300k pull-up
- 300k pull-down
- GPO with push-pull or open-drain
- Programmable Logic Block
- PWM generator
- Internal PWM Generation
- External PWM with internal PWM AND function - Reset generators
- I2C interface with Fast-mode plus (Fm+) support up to 1MHz
- Open drain interrupt output
- 16 bump WLCS
The ADP5585 is a 10I/O port expander with built-in keypad matrix decoder, programmable logic, reset generator, and PWM generator. I/O expander ICs are used in portable devices (phones, remote controls, & cameras) and non-portable applications (healthcare, industrial & instrumentation). I/O expanders can be used to increase the number of I/Os available to a processor or to reduce the number of I/Os required through interface connectors for front panel designs.
The ADP5585 handles all key scanning and decoding and can flag the main processor via an interrupt line that new key events have occurred. GPI changes and logic changes can also be tracked as events via the FIFO, eliminating the need to monitor different registers for event changes. The ADP5585 is equipped with a FIFO to store up to 16 events. Events can be read back by the processor via an I2C compatible interface.
The ADP5585 frees up the main processor from having to monitor the keypad, thereby reducing power consumption and/or increasing processor bandwidth for performing other functions.
The programmable logic functions allow common logic requirements to be integrated as part of the GPIO expander, saving board area and cost.
APPLICATIONS
- Keypad entries and input/output expansion capabilities
- Smart phones, remote controls, and cameras
- Healthcare, industrial, and instrumentation
Documentation
Device Drivers 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADP5585ACBZ-00-R7 | 16-Ball WLCSP (1.59mm x 1.59mm) | ||
| ADP5585ACBZ-01-R7 | 16-Ball WLCSP (1.59mm x 1.59mm) | ||
| ADP5585ACBZ-02-R7 | 16-Ball WLCSP (1.59mm x 1.59mm) | ||
| ADP5585ACBZ-04-R7 | 16-Ball WLCSP (1.59mm x 1.59mm) | ||
| ADP5585ACPZ-00-R7 | 16-Lead LFCSP (3mm x 3mm w/ EP) | ||
| ADP5585ACPZ-01-R7 | 16-Lead LFCSP (3mm x 3mm w/ EP) | ||
| ADP5585ACPZ-03-R7 | 16-Lead LFCSP (3mm x 3mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Aug 6, 2014 - 13_0223 Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China |
||
| ADP5585ACPZ-00-R7 | PRODUCTION | |
| ADP5585ACPZ-01-R7 | PRODUCTION | |
| ADP5585ACPZ-03-R7 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
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ADP5585 Evaluation Board
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