AD670
NOT RECOMMENDED FOR NEW DESIGNS8-Bit Signal Conditioning ADC.
- Part Models
- 6
- 1ku List Price
- Starting From $26.57
Part Details
- Complete 8-Bit Signal Conditioning A/D Converter Including Instrumentation Amp and Reference
- Microprocessor Bus Interface
- 10 µs Conversion Speed
- Flexible Input Stage: Instrumentation Amp Front End Provides Differential Inputs and High Common-Mode Rejection
- No User Trims Required
- No Missing Codes Over Temperature
- Single +5 V Supply Operation
- Convenient Input Ranges
- 20-Pin DIP or Surface-Mount Package
- Low Cost Monolithic Construction
- MIL-STD-883B Compliant Versions Available
The AD670 is a complete 8-bit signal conditioning analog-to-digital converter. It consists of an instrumentation amplifier front end along with a DAC, comparator, successive approximation register (SAR), precision voltage reference, and a three-state output buffer on a single monolithic chip. No external components or user trims are required to interface, with full accuracy, an analog system to an 8-bit data bus. The AD670 will operate on the +5 V system supply. The input stage provides differential inputs with excellent common-mode rejection and allows direct interface to a variety of transducers.
The device is configured with input scaling resistors to permit two input ranges: 0 mV to 255 mV (1 mV/LSB) and 0 to 2.55 V (10 mV/LSB). The AD670 can be configured for both unipolar and bipolar inputs over these ranges. The differential inputs and common-mode rejection of this front end are useful in applications such as conversion of transducer signals superimposed on common-mode voltages.
The AD670 incorporates advanced circuit design and proven processing technology. The successive approximation function is implemented with I2L (integrated injection logic). Thin-film SiCr resistors provide the stability required to prevent missing codes over the entire operating temperature range while laser wafer trimming of the resistor ladder permits calibration of the device to within ±1 LSB. Thus, no user trims for gain or offset are required. Conversion time of the device is 10 µs.
The AD670 is available in four package types and five grades. The J and K grades are specified over 0°C to +70°C and come in 20-pin plastic DIP packages or 20-terminal PLCC packages. The A and B grades (-40°C to +85°C) and the S grade (-55°C to +125°C) come in 20-pin ceramic DIP packages.
The S grade is also available with optional processing to MIL-STD-883 in 20-pin ceramic DIP or 20-terminal LCC packages. The Analog Devices Military Products Databook should be consulted for detailed specifications.
Documentation
Data Sheet 2
Application Note 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8763501RA | 20 ld Side-Brazed CerDip | ||
| AD670JNZ | 20-Lead PDIP | ||
| AD670JPZ | 20-Lead Flatpack | ||
| AD670KPZ | 20-Lead Flatpack | ||
| AD670SD/883B | 20-Lead CerDIP (Side Brazed) | ||
| AD670SE/883B | 20-Lead CerDIP (Side Brazed) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
| No Match Found | ||
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 5962-8763501RA | ||
| AD670SD/883B | ||
| AD670SE/883B | ||
|
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| 5962-8763501RA | ||
| AD670SD/883B | ||
| AD670SE/883B | ||
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 5962-8763501RA | ||
| AD670SD/883B | ||
| AD670SE/883B | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 5962-8763501RA | ||
| AD670JNZ | PRODUCTION | |
| AD670SD/883B | ||
| AD670SE/883B | ||
|
Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek |
||
| AD670JNZ | PRODUCTION | |
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| AD670JNZ | PRODUCTION | |
|
Jul 27, 2021 - 21_0111 Obsolescence of AD670JPZ and AD670KPZ |
||
| AD670JPZ | LAST TIME BUY | |
| AD670KPZ | LAST TIME BUY | |
This is the most up-to-date revision of the Data Sheet.
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