ADuM2251

PRODUCTION

Hot-Swappable Dual I²C^® Isolators, 5 kV

Data Sheet (Rev. D)

Part Models: 6
1ku List Price: Starting From $3.41

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Part Details

Bidirectional I²C communication
Open-drain interfaces
Suitable for hot swap applications
30 mA current sink capability
1000 KHz operation
3.0 V to 5.5 V supply/logic levels
16-lead SOIC wide body package version (RW-16)
High temperature operation: 105°C

16-lead SOIC wide body enhanced creepage version (RI-16-2)
Safety and regulatory approvals
UL recognition: 5000 V rms for 1 minute per UL 1577
5000 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice 5A (RI-16-2 package)

Part Models: 6
1ku List Price: Starting From $3.41

Documentation

Frequently Asked Question 1

FAQ 05/17/2017

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADUM2251ARIZ	16-Lead SOIC (Increased Creepage)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADUM2251ARIZ-RL	16-Lead SOIC (Increased Creepage)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADUM2251ARWZ	16-Lead SOIC Wide	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADUM2251ARWZ-RL	16-Lead SOIC Wide	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADUM2251WARWZ	16-Lead SOIC Wide	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADUM2251WARWZ-RL	16-Lead SOIC Wide	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Sep 22, 2015 - 15_0135 Alternate Assembly Site of Select Isolator Products in 8L/16L SOIC_N, 16L/20L SOIC_W and 16L/20L SOIC_IC at ASE Chungli
		PCN15_0135_Form Material_Report Detailed Change Description Qualification Results Summary
ADUM2251ARIZ	PRODUCTION
ADUM2251ARIZ-RL	PRODUCTION
ADUM2251ARWZ	PRODUCTION
ADUM2251ARWZ-RL	PRODUCTION
Nov 19, 2013 - 13_0109 Notification of qualification of Alternate Fab Foundry at ADI Limerick for TC die in Isolation products.
		PCN13_0109_Form Material_Report Qualification Report Summary Detailed Change Description
ADUM2251ARIZ	PRODUCTION
ADUM2251ARIZ-RL	PRODUCTION
ADUM2251ARWZ	PRODUCTION
ADUM2251ARWZ-RL	PRODUCTION
Nov 6, 2013 - 13_0283 Change of Moisture Sensitivity Level Rating for iCoupler Products Assembled in an RI-16 Package from MSL 1 to MSL 3
		PCN13_0283_Form Material_Report
ADUM2251ARIZ	PRODUCTION
ADUM2251ARIZ-RL	PRODUCTION
Dec 18, 2012 - 12_0228 ADuM125x/ADuM225x Die Revision
		PCN12_0228_Form Material_Report Qualification Report Summary
ADUM2251ARIZ	PRODUCTION
ADUM2251ARIZ-RL	PRODUCTION
ADUM2251ARWZ	PRODUCTION
ADUM2251ARWZ-RL	PRODUCTION
Feb 27, 2012 - 11_0066 Qualification of Alternate Fab Foundry Gold Plating Process Site for Isolation Products at ADI Limerick.
		PCN11_0066_Form Material_Report Qualification Plan Summary Flow Chart
ADUM2251ARIZ	PRODUCTION
ADUM2251ARIZ-RL	PRODUCTION
ADUM2251ARWZ	PRODUCTION
ADUM2251ARWZ-RL	PRODUCTION
Apr 27, 2016 - 15_0135 Alternate Assembly Site of Select Isolator Products in 8L/16L SOIC_N, 16L/20L SOIC_W and 16L/20L SOIC_IC at ASE Chungli
		PCN15_0135_Form Material_Report Qualification Results Summary Qualification Results Summary Detailed Change Description Qualification Results Summary
ADUM2251WARWZ	PRODUCTION
ADUM2251WARWZ-RL	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Evaluation Kits

ADuM1250 Evaluation Board

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Features and Benefits

Access to two bidirectional data channels
Multiple connection options
Support for active probes
Provisions for cable terminations
Support for PCB edge mounted coaxial connectors
Easy configuration

Product Details

The EVAL-ADuM1250EBZ supports two bidirectional channels for evaluation of isolated I2C interfaces in 8-lead SOIC packages. The evaluation board provides a JEDEC standard, 8-lead SOIC_N pad layout. This layout supports signal distribution, loopback, and loads referenced to the VDDx or GNDx planes, as well as optimal bypass capacitance. Signal sources can be conducted to the board through header pins or through edge mounted Sub- miniature Version A (SMA) connectors (SMA connectors must be ordered separately).

Screw terminal blocks on the evaluation board provide power connections. The board includes 200 mil (5.08 mm) header positions for compatibility with active probes (probe header pins must be ordered separately). The EVAL-ADuM1250EBZ evaluation board can be used to evaluate the ADuM1250, ADuM1251, ADuM2250, and ADuM2251 devices. Although the pad layout on the EVAL- ADuM1250EBZ does not support the ADuM2250 and ADuM2251 16-lead SOIC_W and SOIC_IC packages, these devices are functionally equivalent to the ADuM1250 and ADuM1251, respectively, for the purposes of evaluation. They differ only by package and isolation capabilities. Therefore, evaluations of the ADuM1250 and ADuM1251 can be applied to the ADuM2250 and ADuM2251 as well.

The evaluation board follows best printed circuit board (PCB) design practices for 4-layer boards, including a full power and ground plane on each side of the isolation barrier. No other electromagnetic interference (EMI) or noise mitigation design features are included on this evaluation board. For high speed operation, or when ultralow emissions are required, refer to the AN-1109 Application Note for additional evaluation board layout techniques.

Full specifications for the ADuM1250 are available in the ADuM1250 data sheet, which must be consulted in conjunction with User Guide UG-1100 when working with the evaluation board.