AD744

NOT RECOMMENDED FOR NEW DESIGNS

Precision, 500 ns Settling BiFET Op Amp

Data Sheet (Rev. D) Product Selection Table

Part Models: 12
1ku List Price: Starting From $3.70

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Part Details

AC PERFORMANCE

500 ns Settling to 0.01% for 10 V Step
1.5 µs Settling to 0.0025% for 10 V Step
75 V/µs Slew Rate
0.0003% Total Harmonic Distortion(THD)
13 MHz Gain Bandwidth - Internal Compensation Compensation
>200 MHz Gain Bandwidth (G = 1000) External Decompensation
>1000 pF Capacitive Load Drive Capability with 10 V/µs Slew Rate - External Compensation

DC PERFORMANCE

0.5 mV max Offset Voltage (AD744B)
10 µV/°C max Drift (AD744B)
250 V/mV min Open-Loop Gain (AD744B)
Available in Plastic Mini-DIP, Plastic SOIC, Hermetic Cerdip, Hermetic Metal Can Packages and Chip Form
Surface Mount (SOIC) Package Available in Tape and Reel in Accordance with EIA-481A Standard

There is a newer version of this part available

36 V, Precision, Low Noise, 16.5 MHz JFET Op Amp with Rail-to-Rail Output

Part Models: 12
1ku List Price: Starting From $3.70

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
AD744AQ	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744BQ	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744JCHIPS	none available	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744JNZ	8-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744JRZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744JRZ-REEL	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744JRZ-REEL7	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744KNZ	8-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744KRZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744KRZ-REEL	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744KRZ-REEL7	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD744TH/883B	8-Pin TO-99	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
AD744AQ
AD744BQ
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
AD744AQ
AD744BQ
AD744TH/883B
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
AD744AQ
AD744BQ
AD744TH/883B
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD744JNZ	PRODUCTION
AD744KNZ	PRODUCTION
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
AD744TH/883B
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
AD744TH/883B

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

LTspice

Models for the following parts are available in LTspice:

AD744

VRMS/dBm/dBu/dBV calculators

A utility to convert between standard units of power measurement and signal strength.

Open Tool

Power Dissipation vs Die Temp

This tool estimates die temperature and power dissipation based on the supply voltages, ambient temperature, load characteristics, and package thermal data.

Open Tool

Analog Photodiode Wizard

Use Photodiode Wizard to design a transimpedance amplifier circuit to interface with a photodiode. Select a photodiode from the library included in the tool, or enter custom photodiode specifications. Quickly observe tradeoffs between Bandwidth, Peaking (Q), and ENOB/SNR. Modify circuit parameters, and immediately see results in plots for pulse response, frequency response, and noise gain.

Open Tool

Analog Filter Wizard

Use the Analog Filter Wizard to design low-pass, high-pass, or band-pass filters with actual op amps in minutes. As you progress through the design process, you can observe the characteristics of your filter design from ideal specifications to real world circuit behavior. Quickly evaluate the tradeoffs in op amp specifications - including gain-bandwidth, noise, and supply current – to determine the best filter design for your requirements.

Open Tool

AD744 SPICE Macro Models 8

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Evaluation Kits

Universal Evaluation Board for Single High Speed Operational Amplifiers

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Features and Benefits

Enables quick breadboarding/prototyping
User defined circuit configuration
Edge mounted Subminiature Version A (SMA) connector
provisions Easy connection to test equipment and other circuits

Product Details

The Universal Single High Speed Amplifier Evaluation Boards are bare boards that enable users to quickly prototype a variety of amplifier circuits, which minimizes risk and reduces time to market. These boards are all RoHs Compliant. See ordering guide below on what board to order by lead count and package.