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REF02
过期+5V、+10V精密电压基准
- 产品模型
- 24
Viewing:
产品详情
- Pretrimmed to +5V, +10V
- Excellent Temperature Stability: 3ppm/°C (typ)
- Low Noise: 10µVP-P (REF02)
- Short-Circuit Protected
- Linear Temperature Transducer Output (REF02)
应用
- 模数转换器
- 数字电压表
- 数模转换器
- 门限检测器
- 稳压器
参考资料
数据手册 3
技术文章 3
ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。
| 产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号，脚注和 3D模型 |
|---|---|---|---|
| 85514012A | 20-Lead LCC | ||
| REF02AJ/883C | 8-Pin TO-99 | ||
| REF02AZ | 8-Lead CerDIP | ||
| REF02AZ/883C | 8-Lead CerDIP | ||
| REF02CESA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CESA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02CPZ | 8-Lead PDIP | ||
| REF02CSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSZ | 8-Lead SOIC | ||
| REF02CSZ-REEL | 8-Lead SOIC | ||
| REF02CSZ-REEL7 | 8-Lead SOIC | ||
| REF02EP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02EZ | 8-Lead CerDIP | ||
| REF02HP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02HPZ | 8-Lead PDIP | ||
| REF02HSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSZ | 8-Lead SOIC | ||
| REF02HZ | 8-Lead CerDIP | ||
| REF02NBC-002C | CHIPS OR DIE | ||
| REF02RC/883C | 20-Lead LCC | ||
| REF02Z | 8-Lead CerDIP |
| 产品型号 | 产品生命周期 | PCN |
|---|---|---|
| 未找到匹配项目 | ||
|
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02AZ/883C | 量产 | |
| REF02RC/883C | ||
|
9月 7, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02CPZ | ||
| REF02CSZ-REEL | ||
| REF02HPZ | ||
| REF02HSZ | ||
| REF02HZ | ||
| REF02NBC-002C | ||
| REF02RC/883C | ||
| REF02Z | ||
|
6月 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02AZ/883C | 量产 | |
| REF02RC/883C | ||
|
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02EZ | ||
| REF02HZ | ||
| REF02RC/883C | ||
| REF02Z | ||
|
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02CPZ | ||
| REF02EZ | ||
| REF02HPZ | ||
| REF02HZ | ||
| REF02RC/883C | ||
| REF02Z | ||
|
6月 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02RC/883C | ||
|
7月 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02AZ/883C | 量产 | |
| REF02RC/883C | ||
|
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02EZ | ||
| REF02HZ | ||
| REF02Z | ||
|
10月 11, 2012 - 12_0208 ADR0x and REF0x Die Revision |
||
| REF02AZ | ||
| REF02CPZ | ||
| REF02CSZ | 量产 | |
| REF02CSZ-REEL | ||
| REF02CSZ-REEL7 | ||
| REF02EZ | ||
| REF02HPZ | ||
| REF02HSZ | ||
| REF02HZ | ||
| REF02Z | ||
|
3月 23, 2009 - 09_0005 REF01, REF02 and REF03 Redesign: Startup Circuitry Design Improvement and Input Voltage Maximum Rating Data Sheet Change |
||
| REF02AZ | ||
| REF02CPZ | ||
| REF02CSZ | 量产 | |
| REF02CSZ-REEL | ||
| REF02CSZ-REEL7 | ||
| REF02EZ | ||
| REF02HPZ | ||
| REF02HSZ | ||
| REF02HZ | ||
| REF02Z | ||
|
10月 30, 2020 - 1702R2 ASSEMBLY |
||
| REF02CESA+ | 量产 | |
| REF02CESA+T | 量产 | |
|
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| REF02CPZ | ||
| REF02HPZ | ||
|
5月 22, 2018 - 1702N ASSEMBLY |
||
| REF02CSA+ | 量产 | |
| REF02CSA+T | 量产 | |
| REF02HSA+ | 量产 | |
| REF02HSA+T | 量产 | |
|
11月 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
||
| REF02CSZ | 量产 | |
| REF02CSZ-REEL | ||
| REF02CSZ-REEL7 | ||
| REF02HSZ | ||
这是最新版本的数据手册
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