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製造中止+5V、+10V、高精度電圧リファレンス
- 製品モデル
- 19
- 1Ku当たりの価格
- 最低価格:$1.77
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製品の詳細
- Pretrimmed to +5V, +10V
- Excellent Temperature Stability: 3ppm/°C (typ)
- Low Noise: 10µVP-P (REF02)
- Short-Circuit Protected
- Linear Temperature Transducer Output (REF02)
アプリケーション
- アナログ-デジタルコンバータ
- デジタル電圧計
- デジタル-アナログコンバータ
- スレッショルド検出器
- 電圧レギュレータ
ドキュメント
データシート 3
信頼性データ 1
技術記事 2
製品モデル | ピン/パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
---|---|---|---|
5962-8958101PA | 8 ld CerDIP | ||
REF01AJ/883C | 8-Pin TO-99 | ||
REF01CESA+ | Small-Outline IC, Narrow (0.15in) | ||
REF01CESA+T | Small-Outline IC, Narrow (0.15in) | ||
REF01CJ | 8-Pin TO-99 | ||
REF01CP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
REF01CPZ | 8-Lead PDIP | ||
REF01CSA+ | Small-Outline IC, Narrow (0.15in) | ||
REF01CSA+T | Small-Outline IC, Narrow (0.15in) | ||
REF01CSZ | 8-Lead SOIC | ||
REF01CSZ-REEL | 8-Lead SOIC | ||
REF01CSZ-REEL7 | 8-Lead SOIC | ||
REF01EP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
REF01EZ | 8-Lead CerDIP | ||
REF01HP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
REF01HPZ | 8-Lead PDIP | ||
REF01HSA+ | Small-Outline IC, Narrow (0.15in) | ||
REF01HSA+T | Small-Outline IC, Narrow (0.15in) | ||
REF01HZ | 8-Lead CerDIP |
製品モデル | 製品ライフサイクル | PCN |
---|---|---|
該当なし | ||
4 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
5962-8958101PA | 製造中 | |
REF01AJ/883C | ||
9 7, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
||
5962-8958101PA | 製造中 | |
REF01AJ/883C | ||
REF01CJ | ||
REF01CSZ | 製造中 | |
REF01CSZ-REEL | 製造中 | |
REF01CSZ-REEL7 | 製造中 | |
REF01EZ | ||
REF01HZ | ||
11 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
5962-8958101PA | 製造中 | |
REF01EZ | ||
REF01HZ | ||
6 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
5962-8958101PA | 製造中 | |
REF01AJ/883C | ||
11 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
5962-8958101PA | 製造中 | |
REF01AJ/883C | ||
REF01CJ | ||
REF01EZ | ||
REF01HZ | ||
11 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
5962-8958101PA | 製造中 | |
REF01AJ/883C | ||
REF01CJ | ||
REF01CPZ | 製造中 | |
REF01EZ | ||
REF01HPZ | 製造中 | |
REF01HZ | ||
7 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
5962-8958101PA | 製造中 | |
REF01AJ/883C | ||
6 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
REF01AJ/883C | ||
REF01CJ | ||
10 30, 2020 - 1702R2 ASSEMBLY |
||
REF01CESA+ | 製造中 | |
REF01CESA+T | 製造中 | |
REF01CSA+ | 製造中 | |
REF01CSA+T | 製造中 | |
10 11, 2012 - 12_0208 ADR0x and REF0x Die Revision |
||
REF01CJ | ||
REF01CPZ | 製造中 | |
REF01CSZ | 製造中 | |
REF01CSZ-REEL | 製造中 | |
REF01CSZ-REEL7 | 製造中 | |
REF01EZ | ||
REF01HPZ | 製造中 | |
REF01HZ | ||
3 23, 2009 - 09_0005 REF01, REF02 and REF03 Redesign: Startup Circuitry Design Improvement and Input Voltage Maximum Rating Data Sheet Change |
||
REF01CJ | ||
REF01CPZ | 製造中 | |
REF01CSZ | 製造中 | |
REF01CSZ-REEL | 製造中 | |
REF01CSZ-REEL7 | 製造中 | |
REF01EZ | ||
REF01HPZ | 製造中 | |
REF01HZ | ||
8 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
REF01CPZ | 製造中 | |
REF01HPZ | 製造中 | |
7 20, 2012 - 12_0105 Halogen Free Material Change for Select SOIC Narrow and Wide Body Products Assembled at Amkor |
||
REF01CSZ | 製造中 | |
REF01CSZ-REEL | 製造中 | |
REF01CSZ-REEL7 | 製造中 | |
5 22, 2018 - 1702N ASSEMBLY |
||
REF01HSA+ | 製造中 | |
REF01HSA+T | 製造中 |
これは最新改訂バージョンのデータシートです。
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