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ADG918
PRODUCTIONWideband, 43 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT Switches
- Part Models
- 6
- 1ku List Price
- Starting From $1.64
Part Details
- Wideband switch: −3 dB at 4 GHz
- Absorptive/reflective switches
- High off isolation (43 dB at 1 GHz)
- Low insertion loss (0.8 dB at 1 GHz)
- Single 1.65 V to 2.75 V power supply
- CMOS/LVTTL control logic
- 8-lead MSOP and tiny 3 mm × 3 mm LFCSP
- Low power consumption (<1 µA)
The ADG918/ADG919 are wideband switches using a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG918 is an absorptive (matched) switch having 50 Ω terminated shunt legs, whereas the ADG919 is a reflective switch. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless and general-purpose high frequency switching applications.
Product Highlights
- −43 dB off isolation at 1 GHz.
- 0.8 dB insertion loss at 1 GHz.
- Tiny 8-lead MSOP/LFCSP.
Applications
- Wireless communications
- General-purpose RF switching
- Dual-band applications
- High speed filter selection
- Digital transceiver front end switch
- IF switching
- Tuner modules
Antenna diversity switching
Documentation
Data Sheet 1
User Guide 1
Application Note 2
Technical Articles 1
Video 2
Product Selection Guide 3
Circuit Note 1
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADG918BCPZ-500RL7 | 8-Lead LFCSP (3mm x 3mm w/ EP) | ||
ADG918BCPZ-REEL7 | 8-Lead LFCSP (3mm x 3mm w/ EP) | ||
ADG918BRMZ | 8-Lead MSOP | ||
ADG918BRMZ-500RL7 | 8-Lead MSOP | ||
ADG918BRMZ-REEL | 8-Lead MSOP | ||
ADG918BRMZ-REEL7 | 8-Lead MSOP |
Part Models | Product Lifecycle | PCN |
---|---|---|
Jul 25, 2017 - 17_0068 CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices |
||
ADG918BCPZ-500RL7 | PRODUCTION | |
ADG918BCPZ-REEL7 | PRODUCTION | |
Dec 10, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines |
||
ADG918BCPZ-500RL7 | PRODUCTION | |
ADG918BCPZ-REEL7 | PRODUCTION | |
Oct 26, 2009 - 09_0202 Inclusion of Banding Tape for LFCSP REEL7 parts. |
||
ADG918BCPZ-500RL7 | PRODUCTION | |
Jan 5, 2015 - 14_0246 Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices |
||
ADG918BRMZ | PRODUCTION | |
ADG918BRMZ-500RL7 | PRODUCTION | |
ADG918BRMZ-REEL | PRODUCTION | |
ADG918BRMZ-REEL7 | PRODUCTION | |
May 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products |
||
ADG918BRMZ | PRODUCTION | |
ADG918BRMZ-500RL7 | PRODUCTION | |
ADG918BRMZ-REEL | PRODUCTION | |
ADG918BRMZ-REEL7 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Software Resources
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LTspice
Models for the following parts are available in LTspice:
- ADG918
S-Parameter 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
Evaluation Kits
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